[PR] Cooler Master Awarded iF Design Awards 2013 for TPC 812 & 612 CPU Cooler

Taiwan – Mar. 2013 – Cooler Master, an industry leading chassis, thermal solution, peripheral, and accessory manufacturer, is the recipient of iF Product Design Awards for Cooler Master TPC 812, Cooler Master TPC 612 CPU Coolers. These products edged out 3,011 entries. This brings the total number of iF awards that Cooler Master has received to 14. http://exhibition.ifdesign.de/winner_en.html?ma_id=47

[ The World’s First Vapor Chamber OverClock CPU Cooler】

True Performance Cooling

TPC 812 & 612 are the world’s first CPU coolers that combines vertical vapor chambers with heat pipes. They were specially designed for overclocked processors and represent the pinnacle of high performance heatsinks. Compared to heatpipes along, vertical vapor chambers provide 3 times the fin contact area while cutting airflow resistance in half. The TPC series is compatible with nearly all PC systems thanks to its compact and solid aluminum and copper construction.

Until today, Cooler Master is continuing to praise recommend won international awards and media awards worldwide. Such as International Computex Design & Innovation award, The Good Innovation Award from VR-Zone, Southeast Asia, the Innovation award from HKEPC, Hong Kong, The Best Value award from Tweaktown, United States and Australia, The Best CPU Cooler 2012 award from hermitage akihabara, Japan.

Compared to these numerous awards, Cooler Master is feel more glory of providing innovative products for the global players and Overclockers.

For more information about Vapor Chamber Technology Introduction, please view it at http://www.coolermaster.com/news.php?id=6265&action=ViewNews